TM 11-5895-1090-34/TO 31 R2-2TSC-152
Figure 4-10. Component Location Diagram, Transient Suppress or Assembly A4.
Section III. REPAIR
4-10. General
CAUTION
Repair of the rf low power alarm assembly and
Do not apply heat at a through hole for
thermoelectric power alarm consists of removing and
more than 8 seconds.
replacing faulty components on the circuit boards.
Standard shop practices should be used for these
NOTE
repairs. A low wattage (30 watts or less) soldering iron
along with suitable heatsinks should be used to remove
Before removing diodes or polarized
and replace components. The general practices and
capacitors, note polarity markings and
precautions
for
printed
circuit
boards
and
orientation on the circuit board.
microelectronic components should be observed when
performing the repairs.
(1) On the back of the board (side opposite
components), place soldering iron on the pad of the
Capacitors
component to be removed until the solder begins to melt
a. Removal. Remove leads not connected to
the ground plane first.
4-16
