TM 11-5895-1090-34/TO 31 R2-2TSC-152
NOTE
clean as indicated by the absence of solder on the walls,
top, and bottom.
Do not crimp or bend leads to hold the
component in position for soldering.
(1) Use a small paint brush or the tip of a pipe
The protruding portion of the lead
cleaner dipped in solvent and carefully clean both sides
should remain straight to prevent
of the circuit card in the mounting area. Clean the
damage to the circuit card if subsequent
mounting holes and pads.
replacement is required.
(2) Carefully bend the leads of the new com-
ponent to the same configuration of the old one so that
(5) Use diagonal cutting pliers. Cut the leads
the leads fit into the correct through holes. Do not cut
so that the protruding lengths match those of other
the leads at this time.
components, approximately 1.5 mm (0.063 in.).
CAUTION
CAUTION
Do not apply heat at a through hole for
longer than 8 seconds.
Do not apply heat at a through hole for
longer than 8 seconds.
(3) Apply soldering iron tip to the through hole
that is connected to the plane. When the solder begins
(6) Use flux and solder sparingly. Solder each
to melt, insert the proper lead into the through hole. Be
lead at the side opposite the component. Be sure that
sure that the component is properly oriented on the
the component does not shift position during the
circuit board.
soldering procedure.
(4) Gently maneuver the component, inserting
(7) Allow circuit card to cool before applying
the leads into the proper through holes. Continue with
heat to the other through holes. Repeat procedure for
rocking movement until the component is inserted to the
each lead.
proper depth.
(8) Carefully inspect all new solder points for
evidence of poor connections, cold or excess solder, or
short circuits. Solder should completely fill the hole
without excess solder (fig. 4-16).
Figure 4 - 16. Multilead Component Installation.
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