TM
11-5820-922-40-1
8.
WARNING
If the repair appears wet and
well bonded, install and solder an
eyelet as described in steps 3 thru
Adhesives are irritating to
the skin and eyes upon con-
7 of paragraph 3-23.
tact, and may emit harmful
REMOVAL OF BONDED PARTS. A
vapor. Use only with ade-
part that has been bonded to a cir-
quate ventilation. Avoid
cuit card (with an epoxy adhesive
all skin and eye contact.
or similar compound) can be removed
Use protective clothing such
after the leads have been clipped
as rubber gloves, apron and
or unsoldered by breaking the defec-
eye protection. Wash off
immediately any accidentally
tive part or by applying heat to
contaminated skin area.
the bonding compound. The method
to be used depends on the type of
Hand washing facilities and
part and its location. If a defec-
eye wash fountain should be
tive part cannot be removed by
provided. Do not take
heat, cut or break the part away
internally.
from the bonding compound. In some
cases, the part to be replaced is
so closely positioned between other
3. Apply a thin, smooth coat of
parts that one lead must be cut
clear epoxy adhesive to the area
from which the defective pad was
close to the body of the defective
part to permit the application of a
removed.
prying tool. Wherever possible,
4.
cut the defective part with
Place the new pad, as nearly
as possible, in the exact position
diagonal cutting pliers.
of the defective pad. Insert a
round, pointed toothpick in the
hole to help in alignment. Press
the pad firmly in place with an
orange stick while gently removing
Never apply excessive pressure
the toothpick from the hole.
against a circuit card.
5. Allow the epoxy adhesive to
3-26. Regardless of the tool
set for 1 hour at room temperature.
employed (round-pointed or spade
6.
type), great care must be exercised
Carefully remove surplus
in its use to prevent the circuit
adhesive by using a clean cloth
card or other parts from being
dipped in toluene or other suitable
damaged or broken. Apply the point
solvent.
of the tool against the bonding
compound and between the part and
WARNING
the circuit card. Use the tool so
that it works away the bonding
compound from the part to be broken
Handling hot items presents a
until enough has been removed for
serious injury potential.
the tool to exert pressure against
Asbestos gloves are required.
the part. Keep the leverage sur-
face area of the tool flat against
the surface of the circuit card to
7.
Cure the repaired pad in an
prevent the tool from gouging or
oven 10 F or let it stand at room
breaking the board.
temperature for 24 hours.
