TM 11-5895-1090-34/TO 31 R2-2TSC-152
Figure 4 - 14. Two - Lead Component Installation.
Replacement of Multilead Components
It may be necessary to reheat some
through holes because of residual
solder in the holes. While reheating,
(1) Locate the component to be removed.
use the tip of a soldering aid to push the
Note the position, lead conformation, and physical
lead to the center of the hole to prevent
alignment of the component. Observe the position of
the orientation tab (if any). Determine the pads and
through holes used for mounting.
(2) Lay the circuit card on a clean surface with
the component side down.
Do not apply heat at a pad or through
hole for longer than 8 seconds.
If any lead is connected to the ground
plane, remove that lead last. Do not
remove the solder from the associated
(3) Place the soldering iron tip to one pad and
lead until the solder beings to melt. Use a solder sipper
to remove excess solder. More solder may be required
to conduct heat into the hole and to provide suction for
(4) Allow circuit board to cool before applying
Figure 4-15. Multilead Component Removal Diagram.
heat to through holes in the same area. Repeat
procedure for each lead not connected to the ground
plane, then perform (5) below.
(6) When all leads have been unsoldered,
(5) Apply soldering iron tip to the pad and lead
remove the component from the board.
connected to the plane. When the solder begins to
(7) When the component has been removed,
melt, grasp the component and gently extract the lead
reheat each hole that is not connected to the ground
from the through hole. Be sure that the through hole is
plane. When the solder is melted, use a solder sipper to
completely heated and that the solder has melted on
remove excess solder. Allow the circuit board to cool
both sides of the circuit board. If excessive force or
before reapplying heat in the same area. Repeat
twisting motion is applied, the through hole may be
procedure as required until each through hole is
pulled out of the board along with the lead.