TM 11-5895-1090-34/TO 31 R2-2TSC-152
Figure 4-11. Two Lead Component Removal Diagram.
(5) On the component side of the circuit board,
(2) Use a solder sipper and remove the solder
from the hole. More solder may be required to conduct
(6) Apply soldering iron tip to the pad and lead.
heat into the hole and provide better suction for
When the solder begins to melt, grasp the lead end with
long-nose pliers. Gently extract the lead from the
(3) With long-nose pliers, remove the lead
Be sure that the through hole is
from the hole. It may be necessary to reheat the lead as
completely heated, and that the solder has melted on
a certain amount of solder will remain in the through
both sides of the board. If excessive force is applied,
the through hole may be pulled out of the board along
(4) Repeat the procedure if the remaining lead
with the lead.
is not connected to the ground plane. If the lead is
connected to the ground plane, proceed with steps (5)
Figure 4 - 12. Ground Plane Lead Removal Diagram.
(7) When all leads have been unsoldered,
(8) When component has been removed,
remove component from the circuit board.
reheat the ungrounded holes. When the solder
is melted, use a solder sipper to remove excess
solder. Repeat procedure as necessary until the
holes are clear as indicated by lack of solder on
It may be necessary to reheat some
the walls, top, or bottom.
through holes. While reheating, use the
to the center of the hole to prevent