TM 11-5895-1090-34/TO 31 R2-2TSC-152
Figure 4-10. Component Location Diagram, Transient Suppress or Assembly A4.
Section III. REPAIR
Repair of the rf low power alarm assembly and
Do not apply heat at a through hole for
thermoelectric power alarm consists of removing and
more than 8 seconds.
replacing faulty components on the circuit boards.
Standard shop practices should be used for these
repairs. A low wattage (30 watts or less) soldering iron
along with suitable heatsinks should be used to remove
Before removing diodes or polarized
and replace components. The general practices and
capacitors, note polarity markings and
orientation on the circuit board.
performing the repairs.
(1) On the back of the board (side opposite
of Resistors, Diodes, and
components), place soldering iron on the pad of the
component to be removed until the solder begins to melt
a. Removal. Remove leads not connected to
the ground plane first.